• FLEXIBLE COOLING SOLUTION: Have versatile deployments through multiple system architectures and designs.
• HIGH-DENSITY LOAD MANAGEMENT: Deliver direct-to-chip and RDHx cooling capacity to accommodate high density racks.
• REDUCED TOTAL COST OF OWNERSHIP: Get cost savings with high efficiency, high density cooling capacity.
• PEACE OF MIND: Get equipped with redundant pumps, built-in filtration, and unit-to-unit communication capabilities.
• RAPID DEPLOYMENT: Easily and quickly install and deploy this in any data center environment with in-row or perimeter placement.

• Banking, Financial and Insurance

• Data Center/Colocation/Hosting

• Education

• Government

• Healthcare

• Manufacturing

• Retail and Wholesale

• Telecom

Seamlessly transition to high-efficiency liquid cooling technology with Vertiv™ CoolChip CDU (next generation of Vertiv™ Liebert® XDU family). From hyperscale and colocation environments to edge applications, the Vertiv CoolChip CDU offers flexible deployments for rear door heat exchangers or direct contact liquid cooling. It allows for in-rack, end of row, or perimeter placement options. Easily distribute coolant to efficiently manage power dense deployments with liquid-to-liquid heat exchange up to 100 kW, 450 kW, 600 kW, or 1,350 kW, and liquid-to-air heat exchange up to 70kW. With precise temperature control, this unit can eliminate thermal shock. Have reliable operations with its redundant pumps and dual power feeds and added peace of mind with remote monitoring and communications.

Benefits